Conference Introduction

Sponsored by the ministry of science and technology of People’s Republic of China and Chinese Academy and Sciences, SIP has held CHInano Conference & Expo each year since 2010.This year is going to be 13th CHInano. With 12 years success, CHInano has become the most influential conference & Expo for nano technology in China. Since 9th CHInano in 2018, Wintech-Nano(Suzhou)Co., Ltd. Joined by Jiangsu Nano Technology Innovation Center has sponsored Symposium for Failure Analysis & Application in CHInano. In the past 4 years, the symposium was supported by companies, associations, universities and institutes, and attracted more than 1500 professionals from semiconductor industry.

2023 5th Symposium for Semiconductor Failure Analysis & Application will focus on failure analysis of RF IC, Filter IC and Power Device. This year symposium will share FA learnings and case studies for attendees. This year,We will invite experts, professors, researchers and engineers to Share relevant analysis and testing technology cases, and discuss the development and application trend of semiconductor analysis and detection technology.

Conference Introduction

Organization

Hosts

    1. Wintech-Nano(Suzhou)Co.,Ltd.

    2. Semiconductor Industry Association – MEMS Branch

    3. Nanopolis Suzhou Co., Ltd.


Co-organizers

    • ThermoFisher Scientific

    • Hitachi High-Tech Scientific Solutions (Beijing) Co., Ltd. 

    • ZEISS China

    • Oxford Instruments

    • www.instrument.com.cn

Main topics

Main topics

Topics discussed at this meeting included but are not limited to:

2023 Speakers

Date: Mar. 2
Location: B1 Exhibition Hall Room 1
Speakers
Yingxi Niu (Professor of Institute of semiconductors, Chinese Academy of Sciences)
Characterization of Silicon Carbide Defects and Their Effects on Device Performance

Biography: Professor; received the Ph. D. degree from Xidian University, and Postdoctoral from Chinese Academy of Sciences; got a reward of “6th 3rd generation semiconductor innovation youth”; He is also the leader of the “Third generation List of semiconductor materials and devices” industry innovation team, a technical leader in Anhui Province and Wuhu; He is now a part-time member of the international IEC and Semi Compound Standards Committee, and a member of the China International Standards Committee Member of the National Semiconductor device and List of semiconductor materials standards committee. Focus on SiC R&D and industrialization; undertaking a number of scientific research projects; applied for more than 100 patents; published more than 40 papers.

Abstract: At present, there are many defects in silicon carbide materials, such as base-plane dislocations, screw dislocations, edge dislocations, stacking faults, triangle defects, droplet defects, etc., which result in the low yield and unstable performance of silicon carbide devices, and even affect the long-term reliability. In the research, it is very important for defect control engineering to characterize the defect accurately. This presentation introduces the main defects in silicon carbide and their characterization techniques, as well as the effects of defects on device performance and reliability.

Speakers
Xiwen Zhang (Manager of Hitachi High-Tech Scientific Solutions (Beijing) Co.,Ltd. )
Hitachi EM Products for the Most Advanced Semiconductor Process

Biography: Zhang Xiwen, Manager of Sales support group, Hitachi High-Tech Scientific (Beijing) Co., Ltd(HSC). Zhang Xiwen(Zhang) joined the Beijing Branch of Hitachi High-Tech (Shanghai) International Trade Co., Ltd.(HTG) in August 2012, and served as the technical support for after-sales service of Hitachi EM products. In the same year, Zhang went to Japan for a half year production technology training in the factory. After the training, Zhang learned the design concept, assembly process, technical characteristics, etc. of Hitachi EM in detail; After returning to Beijing in 2013, Zhang continued to working as the after-sales service and technical support of Hitachi EM, and served as the pre-sales technical support of Hitachi EM products.Since 2016, Zhang has been responsible for the promotion of Hitachi Focused Ion Beam(FIB) in China, as well as the technical support and training for Hitachi EM related products .In 2021, HTG EM department and AI department were integrated with the original Tianmei High-tech company(TSL) to establish HSC, Zhang will continue responsible for the technical support of Hitachi FIB and some industry customer in the new company. 

Abstract: Hitachi has many products including SEM, TEM, FIB, AFM and NP, which can provide complete solutions in semiconductor manufacturing, defect detection, packaging and other fields.Hitachi FE-SEM has the characteristics of ultra-high resolution, ultra-high stability, and has a good reputation in the semiconductor field.In the observation and analysis of semiconductor samples, FIB and NP are used more and more, especially in the most advanced processes. These two machines are indispensable in the analysis and testing laboratory. Hitachi NP, with its unique EVAC function, can help customers quickly find the defect location. With its unique stage design, it can be easily found even in a large range; The double exchange chamber design can better maintain the cleanliness of the probe and so on.Hitachi FIB can provide full manual and automatic functions in TEM sample preparation; Triple-Beam the unique function can provide a better solution for preparing higher quality samples. 

Speakers
Sarah Ma (Application Scientist of Oxford Instruments )
Latest EDS and EBSD Progress on Characterizing Semi Samples

Biography: Sarah Ma obtained his Ph.D. in Material Science and Engineering in 2012 from Shanghai Jiaotong University, where she worked on development and characterization of high strength and ductile magnesium alloys. She then completed her postdoctoral work at National Institute of Material Science (NIMS, Japan) and there her major research was characterization of magnesium and magnetic material using HAADF-STEM and 3DAP. After joining in Oxford Instrument as application scientist in 2016, she mainly focuses on application support of EDS, EBSD and OP products.

Abstract: As a common crystallographic analysis tool, EBSD has been extensively used among material researches. Yet, rare reports are about its application in semi-industry, which is mainly due to its limitation about sensitivity, spatial and angular resolution as well as speed. Oxfords Instruments flagship product Symmetry provides unparallel performance that enables EBSD analysis on features down to tens of nanometers and gives results on phases and grain structures etc. in a single measurement. Combining with the cutting-edge EBSD technology, detailed dislocation structures and distributions can also be calculated. With all these improvements, EBSD can now be applied to reveal a new approach of studying defects and failure in semi samples.

Starting with EBSD basics, this talk will focus on EBSD’s latest application on semi samples.

Speakers
Billy Tang ( Manager of EFA Sales Development, ThermoFisher Scientific)
Improving FA Success Rate by ThermoFisher Total Solution

Biography:  Manager, Failure Analysis: More than 15 years of FA experience in IC Fab; Focused on both EFA & PFA;Sr. Application Specialist:Field application for Nanoprobing in China; Manager, EFA Sales Development & Application Engineers:Sales development for EFA product (Optical Fault Isolation, Lock-in Thermography, Nanoprobing, Circuit Edit) ; Customer interface and application support.

Abstract: This report is focusing on the failure analysis of semiconductor which includes the fundamental and application of FA technologies. By clarifying the workflow from fault isolation and physical verification, this report will point out the key factor of low success rate for regular problems in failure analysis with multiple case studies.In Semiconductor, Thermo Fisher Scientific integrated the total solution from EFA to PFA for customer. In this report, tool performance, limitation of analysis technology, application experience will be integrated to description for improving the success rate of failure analysis.

Speakers
Guanglu Ge (Professor of National Center for Nanoscience & Technology)
Nanomaterial Testing Standards

Biography: Guanglu Ge, professor at National Center for Nanoscience and Technology and Director of CAS Key Lab of Measurement and Standardization for Nanotechnology, obtained his Ph.D. from Columbia University in 2001, and postdoctoral training at UCLA and Caltech. He is now the convenor of ISO/TC229/WG4 (Nanomaterial specification), the deputy director of Technical Committee on Nanotechnology and on Reference Materials of Standardization Administration of China (SAC). Prof. Ge’s research focuses on standardized testing methods and RMs for nanotechnology, nanoscale interface characterization and structure-property relation. He has been the PI of National Key R&D program on scientific problems in nanotechnology metrology and standards, and has published over 80 papers in journals including Advanced Materials and Small, etc. He received IEC 1906 award in 2018. Prof. Ge has led or co-led the drafting of seven ISO/IEC standards and 16 national standards. Specifically, by collaborating with domestic industry, his team developed the standard system in physicochemical characterization of electrode nanomaterials and optical characterization of quantum dots. 

Abstract: Standards ensure the reliability and consistency of nanomaterial measurement and characterization, and are the foundation of nanotechnology industry. The technical committees in ISO, IEC and ASTM have been active in developing  testing standard, on materials including carbon nanotubes, quantum dots, metal nanoparticles, and using methods including electron microscopy, scanning probe microscopy, light scattering, and various spectroscopies. These efforts improve the method comparison and data accuracy, and deepen our understanding of measurement uncertainties.Since 2006, China has supported the research in nano-measurement standards with different programs. As a result, we have led over 30 ISO/IEC international standards including the metallic impurity detection in carbon nanotubes and absorption spectroscopy of quantum dots. We have also developed over 50 reference materials, to promote the nanomaterial characterization and participation of domestic industry in international standardization.This talk will analyze the challenges of standardizing nanomaterial test methods, summarize the current activities and status, and provide perspectives for this field. 

Speakers
Chengliang Huang (BD managerr of ZEISS)
Comprehensive and Advanced Failure Analysis in Compound Semiconductor

Biography: As a business development manager at Carl Zeiss, Chengliang Huang is responsible for Zeiss Microscopy business development in semiconductor, electronics and display industries, to promote innovative application solutions to customers.Since his graduation from University of California, Irvine, he has been working in the field of physical and electrical failure analysis. Chengliang has more than 7 years’ experience in supporting advanced semiconductor failure analysis and FIB/SEM, nanoprobing application development.

Abstract: With the rapid development of new energy vehicle, 5G, IoT, and so on, compound semiconductors are driving the next wave of semiconductor innovation. They usually have high breakdown electric field, direct bandgap, high electron mobility, and other advantages. Because of the special fundamental material properties, compound semiconductors have a wide range of applications where Silicon has some limitations. Although the manufacturing technology has been improving, compound semiconductors tend to have higher crystal defect density and therefore higher production cost. The full range of ZEISS microscopes as well as the semiconductor-oriented software and workflow solutions can not only help the substrate and epitaxial wafer manufactures to identify the crystal defects, but also provide device and package failure analysis solutions for power and optoelectronics IC manufactures.

Speakers
Aiguo Li (Deputy Director of Shanghai Synchrotron Radiation Facility)
Nondestructive Characterization of Synchrotron Radiation in Integrated Circuit Devices

Biography: Aiguo LiDeputy director of SSRF, doctoral supervisor. Also serves as the director of Imaging and Industrial Application Research Department, and the head of the SSRF BL15U Microfocus Beamline. He is engaged in the development and application of synchrotron radiation hard X-ray micro-nano experimental technology, and serves as a project leader of the key R&D plan of the Ministry of Science and Technology, and has published nearly 100 papers.

Abstract: With the shift from 2D to 3D structure of integrated circuit device, the defects and strains brought by immature process can cause the failure of mechanical and electrical properties of the device, and the traditional destructive analysis are difficult to restore the real situation. Thus, nondestructive methods with nano-scale are needed for characterization the integrated circuit devices. In recent years, the continuous development of synchrotron radiation characterization technology makes it possible. Herein, we will introduce several synchrotron radiation characterization techniques, including X-ray ptychography, Bragg ptychography, fast nano-CT full-field imaging techniques and critical dimension small angle X-ray scattering, which can measure and visualize the defects and strains inside integrated circuits in order to fully understand the link between structure and performance of integrated circuit devices.

Speakers
Younan Hua (VP of Wintech Nano-Technology Services Pte.Ltd.)
Studies of EDS, XPS and Auger Analysis Technology and Application in IC Chip Design, Wafer Fabrication and Advanced Packaging (Online)

Biography: Dr. Hua received a Ph.D. degree in Physics from National University of Singapore in 1994. After that he worked in Chartered Semiconductor (GlobalFoundries), which is a major international wafer fab, and served as Director of Failure Analysis Lab in 1995--2013. In 2014, he joined Wintech-Nano (Singapore) as Vice President/COO. He is an expert in semiconductor wafer fab, process and device failure analysis. He has published more than 360 papers/patents. He has deep academic attainments in the field of wafer fab, packaging and failure analysis, especially in the front-end process of wafer fab, research and development of GOI failure analysis methods and the advanced fab process of anti-pollution and corrosion on Al Bondpads in the back-end wafer fab process with the international leading level. He is also actively engaged in and caring about education, and is assigned as a member of the Educational Advisory Committee in National University of Singapore and a PhD Supervisor at National University of Singapore/Nanyang Technological University /Singapore University of Technology and Design / Singapore Economic Development Board / Wintech-Nano IPP Platform).

Abstract: X-ray energy dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) are very useful analytical techniques. They have been widely used in material analysis and failure analysis, especially semiconductor integrated circuit design, wafer fabrication and modern packaging and testing. However, as the size of semiconductor chips is getting smaller and smaller, reaching 7-5nm or even 3-2nm, the technical requirements for material analysis and failure analysis are getting higher and higher. In this invited talk, we will discuss with you in-depth the theoretical and applied studies of the three analysis techniques, and share and demonstrate the application experience of these three analysis techniques in integrated circuit wafer fabrication and modern packaging and testing through some application cases. In particular, the advantages and disadvantages and application scenarios of the three analysis techniques are compared. We will help failure analysis and quality engineers & management personnel how to choose the appropriate analysis technology so as to improve the accuracy and precision of material analysis and failure analysis, thereby improving the yield of semiconductor integrated circuit wafer fabrication and advanced packaging and testing processes. In particular we will propose the concept of “EDS clean is not clean and Auger clean is then clean”.

Speakers
Feng Luo (Chair Professor of Nankai University)
Ultra Precision Manufacturing and Integrated Circuit Equipments

Biography: Feng Luo, Chair Professor, School of Materials Science and Engineering/School of Electronic Information and Optical Engineering, Nankai University Since 2021.Feng is currently a chair professor of School of materials science and engineering of Nankai University and an adjunct chair professor of Xi’an Jiaotong University from 2018-2020. From 1995 to 2004, he studied at the school of chemistry and molecular engineering, Peking University, and received his bachelor’s and doctor’s degrees. From 2004 to 2009, he worked in Germany and Switzerland as a postdoctor, and from 2009 to 2010, he served as a Principle Investigator in the Collge of Engineering of Peking University. From 2010 to 2020, he worked in the IMDEA Nanoscience as a senior research Professor. He has been selected as a Marie Curie scholar of the European Union, the Spanish fund for Distinguished Young scholars, the Spanish I3 distinguished professor, etc. At present, he serves as a board member of the science and innovation commission of the Institute of Advanced Science FacilitiesShenzhen, the member of Shanghai Light Source User Committee.

Abstract: A brief review over technologies focused on micro/nano fabrication and ultra-precision manufacturing has been descried for patterning devices in 10 nm tech-node and beyond.

Speakers
Jianyou Xie (CEO of Hunan Overmoore Advanced Semiconductor Co., Ltd.)
Technology Status and Development Trend of SiP Advanced Packaging

Biography: Jianyou Xie is currently the CEO/CTO of Hunan Overmoore Advanced Semiconductor Co., Ltd., graduated from Dalian University of Technology with a bachelor’s degree in fine chemical engineering, and graduated from Xidian University with a master’s degree in the field of integrated circuit engineering. He has worked in world-class foreign enterprises or listed companies over 20 years, and has built an advanced packaging product line in Huatian Technology (Xi’an) Co., Ltd, which is a listed company. In 2002, Mr. Jianyou Xie worked in Unictech and GAPT (Weiyu Technology), mainly engaged in the packaging design and process R&D of CPU products, GPU products and North-South Bridge chips. After Weiyu Technology was acquired by the world’s largest packaging factory (ASE) in 2007, he joined Xingke Jinpeng (formerly the world’s third largest packaging factory) to undertake the packaging design and process R&D of FC products.Previous positions: R&D Director of Huatian Technology (002185), President of Advanced Packaging Research Institute; Chief Scientist of SiP, Tongfu Microelectric (002156) Packaging Research Institute; Director of vivo Packaging Research Institute.He presided over the establishment of Huatian Technology SiP product line and electrical/thermal/force/fluid multi-physical domain collaborative design simulation platform.Patent inventor of fingerprint recognition package scheme under mass-produced capacitive screen (TSV+SiP);Al chip package solution shipments >800kk;He has been awarded 91 national patents and 3 U.S. patents.

Abstract: Standards ensure the reliability and consistency of nanomaterial measurement and characterization, and are the foundation of nanotechnology industry. The technical committees in ISO, IEC and ASTM have been active in developing  testing standard, on materials including carbon nanotubes, quantum dots, metal nanoparticles, and using methods including electron microscopy, scanning probe microscopy, light scattering, and various spectroscopies. These efforts improve the method comparison and data accuracy, and deepen our understanding of measurement uncertainties.Since 2006, China has supported the research in nano-measurement standards with different programs. As a result, we have led over 30 ISO/IEC international standards including the metallic impurity detection in carbon nanotubes and absorption spectroscopy of quantum dots. We have also developed over 50 reference materials, to promote the nanomaterial characterization and participation of domestic industry in international standardization.This talk will analyze the challenges of standardizing nanomaterial test methods, summarize the current activities and status, and provide perspectives for this field. 

Speakers
Xiaomin Li (CEO of Wintech-Nano (Suzhou) Co., Ltd.)
Cyclical Nature of the Semiconductor Industry Through Analytical Testing Sector.

Biography: Li Xiaomin is the founder of WinTech Nano and the Chairman of the WinTech Nano group. Xiaomin studied B.S. in Microelectronics at Peking University and further his M.S. in Microelectronics at the National University of Singapore. He was the top graduate of Peking University and received his Honours from the National University of Singapore. He has published more than 60 technical papers and 2 books as a co-author.After graduating from Peking University, Mr. Li worked at Singapore A*Star and 3 years later, he founded WinTech Nano Singapore in 2004. The success of the company led to the opening of WinTech Nano Suzhou in 2012. Both companies are the leading semiconductor analysis and testing service laboratories.Mr. Li invented the concept of “Labless”, by consolidating "essential non-core" R&D activities from the industry to form a new service sector. He was featured in the book “Youthful Dreams of Towkays” with 108 successful Singapore entrepreneurs published by Lianhe Zaobao veteran journalist, Zheng MingShan. In May 2021, he was featured on the front-page cover magazine of the Fortune Times, as the youngest-ever successful entrepreneur since their publication. He is frequently awarded for his contributions and is highly recognized by the industry.

Abstract: WinTech Nano is a company that has been providing analysis and testing services in the semiconductor industry for 20 years. They have extensive experience in failure analysis and reliability testing services and operate advanced laboratory. The company’s chairman, Mr. Li Xiaomin, has a insightful understanding about semiconductor industry and has proposed Labless business concept to address issues such as high cost of equipment investment and shortage of analysis talent, which aims to support the sustainable development of the semiconductor industry. The company closely analyzes the current state of semiconductor industry and he would like to share his thought about semiconductor future trends.

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